SIGNAL AND POWER INTEGRITY (SIPI 2016)
2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016)
An embedded conference within the 2016 IEEE International Symposium on Electromagnetic Compatibility
Dates: 25 - 29 July 2016
Location: The Shaw Centre, Ottawa, Ontario, Canada
CALL FOR PAPERS
INFORMATION FOR AUTHORS
2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016) will be held as an embedded conference within the 2016 IEEE International Symposium on Electromagnetic Compatibility in the week of 25 to 29 July 2016. Registered attendees will have access to the entire EMC Symposium program, in addition to the programs of SIPI 2016, without additional fees. As high-speed designs continue evolving, signal/power integrity and other EMC problems become tightly related to each other. Thus, the conference provides a unique opportunity for attendees to exchange ideas and share experiences relevant for today’s high-speed designs.
Join your colleagues and experts/innovators in Ottawa, Ontario, Canada for a full week of technical presentations on advances and research works in EMC, SI, PI and other related fields. All papers that are accepted will be published in IEEE Xplore. In addition, authors of accepted papers will be invited to submit an extended version of their symposium paper for possible publication in a special issue of the IEEE Transactions on Electromagnetic Compatibility. Proposals for special sessions, workshops, tutorials and experiments are also highly encouraged.
SIPI PAPER SUBMISSIONS ARE NOW CLOSED.
AUTHOR SUBMISSION SCHEDULE FOR PAPERS
• Preliminary Full Paper Manuscript: 1 November 2015 - 15 January 2016 18 January 2016
(late papers will not be accepted)
• Acceptance Notification: 21 February 2016
• Final Paper Due: 1 May 2016 3 May 2016
Please refer to the Call for Special Sessions and Call for Workshops/Tutorials for their respective submission schedules
• Traditional Oral presentation: Presentation for those interested in presenting to large groups with limited potential for interactions with attendees. Six-page paper maximum, 20 minute presentation with 10-minute question and answer session
• Open Forum: Presentation for those interested in direct interaction with individuals or small groups
STUDENT PAPER CONTEST
Graduate and undergraduate authors are eligible for the Best Student Paper contest. The student must be the primary author and should indicate that they wish to be considered for the contest when submitting the preliminary manuscript. Each student’s professor will be asked to certify that the paper is primarily the work of the student. The 2016 Student EMC Hardware Design Competition is also being held. Learn more.
EMC Society is offering a stipend to encourage and increase the involvement of graduate students and young scientists in the field of Electromagnetic Compatibility. The stipend would provide the equivalent of up to $2000 per person, for no more than 5 full-time students, to cover expenses associated with attendance at an EMC symposium for which they are the presenter of an accepted paper and a first timer at the conference. In addition the IEEE EMC 2016 Symposium committee has agreed to comp those 5 students' attendee fees. Students would need to apply for the stipend; recommendations from supervising professors would be required. Contact Vignesh Rajamani to learn how to apply.
SPECIAL ISSUE OF IEEE TRANSACTIONS ON EMC
Authors of accepted papers will be invited to submit an extended version of their conference paper for possible inclusion in a special issue of the IEEE Transactions on Electromagnetic Compatibility featuring papers from the 2016 IEEE International Symposium on EMC including SIPI 2016. These submissions will be subjected to the same rigorous review as papers submitted for publication in regular issues of the IEEE Transactions on EMC.
GUIDELINES FOR AUTHORS & SUBMITTAL PROCEDURES
Prospective authors must submit electronically**:
• A preliminary manuscript (4 – 6 pages) including all relevant results and conclusions
• Choice of presentation format (traditional oral or open forum)
** Preliminary Manuscripts and Final papers are to be submitted through a website after 1 November, 2015. Check back with the conference web site (TBD) for updates on the paper submission process. During the electronic submission process a unique author code is created for tracking purposes. Submissions are reviewed anonymously so please do not include author names or affiliations on the Preliminary Manuscript. Failure to do so may result in rejection.
PAPER ACCEPTANCE PROCEDURES & CRITERIA
• Importance of Topic: Does it have direct significance to the SI/PI/EMC community?
• Technical Sophistication and Depth: Does it present information that is a significant contribution, advancement, application or refinement of the state of the art? Does it expose the reader to a higher knowledge level than currently available from other sources? Is it clear that the work has been substantially completed or is the submission an interim report of progress on a long term project?
• Readability, Clarity and Presentation: Is the value of the submission clearly defined? Is the material written in clear and concise English, with topics presented in an organized and logical manner?
• Novelty and Originality: Does it propose a new and unique concept or expand on an existing premise from a unique point of view? Does it present new information on an SI/PI/EMC issue that is still in developmental stage?
The template files to be used for all paper submissions can be found here:
SIPI 2016 General Co-Chairs
Ram Achar, Carleton University, Canada (firstname.lastname@example.org)
Dale Becker, IBM, USA (email@example.com)
SIPI 2016 Technical Program Co-Chairs
Xiaoning Ye, Intel, USA (firstname.lastname@example.org)
Joungho Kim, KAIST, South Korea (Joungho@kaist.ac.kr)
The template files for PowerPoint presentations can be found here. This year's screen size is 16:9 widescreen.
If you prefer the 4:3 standard format, choose one of the following templates. (Please be advised that the screens will be 16:9 format so if you use a 4:3 template, your presentation will not utilize the full screen and will be harder for attendees to read.)