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HARDWARE EXPERIMENTS & DEMONSTRATIONS

CALL FOR HARDWARE & DEMONSTRATIONS PROPOSALS

EMC and SI/Power Integrity hardware experiments and demonstrations continue to be a very popular symposium event, and the 2016 IEEE International Symposium on Electromagnetic Compatibility will be no exception. The event’s purpose is to demonstrate important EMC and SI/Power Integrity concepts through interactive experiments and demonstrations focusing on, for example, EM coupling phenomena and effects, EMC and SI/Power Integrity measurements and troubleshooting methods. Presentations may be based upon those documented in the ESAC’s EMC Experiments Manual, originally compiled by Clayton Paul and Henry Ott. Past experiments have demonstrated the effects of PC board radiation coupling; component-cable crosstalk; grounding and shielding strategies; spectral analysis techniques using test hardware; effective EMC and SI/Power Integrity test methods and practices; use of EMC instrumentation to measure interference at the device or component level and the role of EMC standards as part of overall measurement practices. Presentations typically show how fairly simple test hardware can be used to measure a range of electromagnetic effects. Experiments new to the symposium venue are encouraged each year and oft-times popular demonstrations from previous years are reprised. Hands-on participation for attendees during experiments and demonstrations is also encouraged.

Hardware experiments and demonstrations should focus on innovative concepts and methods that are of interest to practicing EMC engineers.

A partial list of potential topics includes:

•    Application of magnetic pickup loops and current probes
•    Transmission-line effects on PCBs
•    Coupling and multi-conductor transmission lines
•    Use of ferrites for EMI control
•    Measurement versus calculation of signal spectra
•    Minimizing magnetic field susceptibility
•    Measurement and control of EMI in spread spectrum systems
•    Measurement of common versus differential mode coupling
•    Proper application of LISNs
•    Electrostatic discharge phenomena
•    Effects of clock frequencies
•    Mode stirring
•    Electromagnetic leakage through seams and joints
•    “Ground” bounce
•    Electromagnetic product safety
•    Signal integrity issues for PCBs


Please contact our Experiments and Demonstrations Co-Chairs with Proposals:         
Bob Scully
bob.scully@ieee.org
Sam Connor
  
sconnor@ieee.org

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